| Application | Features |
|---|---|
| Semiconductor Devices | Low CTE (Coefficient of Thermal Expansion); high reliability. |
| Optical Communication | Fast light curing. |
| LED Packaging | Excellent PCT (Pressure Cooker Test) performance. |
| Thermal Conductive Applications | Good adhesion; high reliability. |
| Sealing & Fixation | UV + thermosetting; high bonding strength; high reliability. |
| Bonding & Fixation | High reliability; reworkable. |
