Camera Module UV Bonding Solutions
UV Adhesives for Camera Module Assembly and Protection
Camera Module – Mobile Applications
| Application | Features |
|---|---|
| Thread Locking Adhesive | Easy rework, low modulus, excellent aging resistance. |
| Non-Thread Height Setting | High adhesion, excellent aging resistance. |
| Dust Capture Adhesive | Outstanding dust collection; prevents stray light. |
| Pin Sealing / Single-Line Adhesive | Easy identification; reworkable. |
| LHA or H/M Adhesive | Overall performance superior to industry peers. |
| AA Adhesive | UV cured in 2 seconds; high bonding strength. |
| Bracket Adhesive | UV cured; easy rework; RA (reliability) stable. |
| Dust Adhesive | Captures white spots and fibers; no residue. |
| Vent Hole Sealing | Fast curing. |
| FPC Reinforcement | UV thermochromic; easy rework. |
Camera Module – Security Applications
| Application | Features |
|---|---|
| Lens Bonding | Transparent matte; prevents stray light; black adhesive for light control. |
| Dust Capture Adhesive | Captures dust; prevents stray light. |
| AA Adhesive | Bonding for linear motor base. |
| Lens Element Bonding | Adhesion meets customer requirements; aging resistant. |
| Optical Lens Bonding | UV thermochromic; effectively prevents appearance defects. |
| Gasket Adhesive | Easy dispensing; no mold opening required. |
| Linear Motor Base Bonding | [Feature similar to AA Adhesive; can note as “Strong adhesion for linear motor base”] |
Camera Module – Automotive Applications
| Application | Features |
|---|---|
| Automotive Camera – Lens | |
| IR Lens Bonding | Low-energy, fast curing; meets reliability requirements. |
| Automotive Lens – Retaining Ring & Lens | Thermosetting adhesive; high bonding strength; high reliability. |
| Automotive Camera Module | |
| Threaded Cap Sealing | UV fast curing; appropriate bonding strength. |
| Lens Fixation | High torque resistance; reworkable. |
| AA Adhesive | High bonding strength; post-aging performance meets industry standards. |
| Damper/Surround Adhesive | Replaces foam for automation; dust barrier. |
| Base Bonding | Low shrinkage; long-term temperature resistance; high bonding strength. |
