UV Encapsulation and Bonding Solutions for Electronic Components
UV Adhesive for Connectors, PCBA, and Mobile Devices
| Application | Features |
|---|---|
| Lighting Connectors & Type-C Encapsulation | Dual 85 test reliability; withstands high temperature 95 °C and low temperature -5 °C; high thixotropy, no leakage. |
| Type-C Interface PIN Protection | Blue color for visual inspection; strong adhesion to PCB; moderate flowability; certain curing depth. |
| Mobile Data Cable Solder Joint Protection | Excellent adhesion to TPU and PC materials. |
| Fingerprint Module – FPC Reinforcement (FPC + Stainless Steel) | UV/moisture dual curing; suitable for piezoelectric valve assembly. |
| BGA Fixation | Strong adhesion to PCB; resistant to reflow soldering. |
| PCBA Modules (CSP, BGA, SMD Corner Bonding) | Excellent adhesion to organic substrates; impact and bending resistance; reworkable and removable. |
